october 2010 doc id 15320 rev 3 1/7 7 EMIF01-TV02F3 single line ipad?, emi filter and esd protection features user-customizable filtering solution (recommended use of 2.2 h external inductor) 8 mhz bandwidth provides very high attenuation at 27 mhz ultralow stand-by power consumption compared to active filters, ideal for portable applications accurate 75 5% impedance matching high efficiency in esd protection (iec standards) high reliability offered by monolithic integration complies with the following standards iec 61000-4-2 level 4 on internal and external pins: ? 15 kv (air discharge) ? 8 kv (contact discharge) application portable applications with analog tv output description the EMIF01-TV02F3 chip is a highly integrated device designed to suppress emi and rfi noise in all systems with a tv analog output signal subjected to electromagnetic interferences. this filter includes esd protection circuitry, which prevents damage to the protected device when subjected to esd surges up 15 kv. the EMIF01-TV02F3 provides high anti-aliasing filtering performances to reject frequencies above 8 mhz, with high attenuation at 27 mhz when an external inductor of 2.2 h is connected between pins b2 and b1. figure 1. pin configuration (bump side) figure 2. configuration tm : ipad is a trademark of stmicroelectronics. gnd gnd in out gnd gnd in out flip-chip package (4 bumps) r1 75? c1 330pf c2 330pf r1 75 o c1 330pf c2 330pf in r1 75 c1 330pf c2 330pf r1 c1 c2 b2 b1 a1 a2 esd 2 kv iec 61000-4-2 level 1 esd 15 kv iec 61000-4-2 level 4 www.st.com
characteristics EMIF01-TV02F3 2/7 doc id 15320 rev 3 1 characteristics figure 3. electrical characteristics (definitions, t amb = 25 c) table 1. absolute maximum ratings symbol parameter value unit v pp internal pins (b1) and external pin (b2): esd discharge iec 61000-4-2, air discharge esd discharge iec 61000-4-2, contact discharge 15 15 kv t j maximum junction temperature 150 c t op operating temperature range -40 to +85 c t stg storage temperature range -55 to 150 c table 2. electrical characteristics (values, t amb = 25 c) symbol test conditions min. typ. max. unit v br i r = 1 ma 6.1 7.9 v i rm v r = 1 ma, between bumps b1 and a1 200 na r1 tolerance 5 % 75 c1, c2 v line = 0 v, v osc = 30 mv, f = 1 mhz (measured under zero light conditions) tolerance: 20% 330 pf symbol parameter v = breakdown voltage i = leakage current @ v v = stand-off voltage v = clamping voltage i = peak pulse current br rm rm rm cl pp v i v cl v br v rm i f v f i rm i pp slope: 1/r d
EMIF01-TV02F3 characteristics doc id 15320 rev 3 3/7 figure 6. esd response to iec 61000-4-2 (-15 kv air discharge) on one input v (in) and on one output v (out) figure 4. s21 attenuation measurement (typical value) in 75/75 environment figure 5. esd response to iec 61000-4-2 (+15 kv air discharge) on one input v (in) and on one output v (out) 100.0k 1.0m 10.0m 100.0m 1.0g - 60.00 - 50.00 - 40.00 - 30.00 - 20.00 - 10.00 0.00 aplac 8.21 user: f:cust# 8463:st microelectronics - tours:applied wave research db l=2.2 h (tdkref: mlf1608a2r2j) 100.0k 1.0m 10.0m 100.0m 1.0g - 60.00 - 50.00 - 40.00 - 30.00 - 20.00 - 10.00 0.00 s21 (db) l=2.2 h (tdkref: mlf1608a2r2j) f (hz) input-output c2 c3 5.00 v/div 5.00 v/div out in 50 ns/div c2 c3 5.00 v/div 5.00 v/div out in 50 ns/div
application information EMIF01-TV02F3 4/7 doc id 15320 rev 3 2 application information an external inductor is used to provide the filtering performance required by the tv-out application. st recommends one of these two references: tdk: mlf1608a2r2j murata: lqm18nn2r2j figure 7. application diagram 3 ordering information scheme figure 8. ordering information scheme r1 75? c1 330pf c2 330pf r1 75 o c1 330pf c2 330pf in out gnd r1 75? c1 330pf c2 330pf r1 75 c1 330pf c2 330pf in out gnd gnd gnd EMIF01-TV02F3 EMIF01-TV02F3 c/cvbs tv_out connector emif yy - xx zz fx emi filter number of lines information package x = resistance value (ohms) z = capacitance value / 10 (pf) or 2 letters = application 2 digits = version f = flip chip x = 3: lead-free, pitch = 400 m, bump = 255 m
EMIF01-TV02F3 package information doc id 15320 rev 3 5/7 4 package information in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 9. package dimensions figure 10. footprint figure 11. marking 0.89 mm 30 m 0.89 mm 30 m 400 m 40 m 255 m 40 400 m 40 m 605 m 55 220 m recommended 220 m recommended 260 m maximum solder stencil opening : copper pad diameter: solder mask opening: 300 m minimum
ordering information EMIF01-TV02F3 6/7 doc id 15320 rev 3 figure 12. flip chip tape and reel specification 5 ordering information table 3. ordering information note: more information is availa ble in the application note: an1235:"flip chip: package description and recommendations for use" an1751: ?emi filters: recommendations and measurements? 6 revision history table 4. document revision history user direction of unreeling all dimensions in mm 4.0 0.1 8.0 0.3 4 0.1 1.75 0.1 3.5 0.1 ? 1.5 0.1 0.95 0.95 xxz yww dot identifying pin a1 location xxz yww xxz yww 8.0 0.3 0.71 0.05 order code marking package weight base qty delivery mode EMIF01-TV02F3 hz flip chip 1.1 mg 5000 tape and reel 7? date revision changes 20-jan-2009 1 initial release. 18-sep-2009 2 updated figure 5 and figure 6 . 06-oct-2010 3 added text above figure 7 .
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